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Failure Mechanisms of Power Devices for Traction Application and Related Lifetime Prediction Techniques

Mercoledì 20 Aprile 2016, alle ore 14:00

Dipartimento di Ingegneria “E. Ferrari”, Aula P1.4

Professor Mauro Ciappa, Swiss Federal Institute of Technology (ETH), Zurich, Switzerland

The end-of-life period of complex multi-chip modules is often defined by themo-mechanics related failure mechanisms. The time-to-the-failure (lifetime) for these wear-out mechanisms is normally estimated on the base of deterministic models, which are calibrated by data extracted from accelerated power cycling experiments. Furthermore, these estimates are referred to a given application profile, which is specific to the technical system under consideration (electric/hybrid car, wind turbines, etc.). Common lifetime prediction models are often based either on well-known expressions for low-cycle fatigue, or on the integration of simplified constitutive equations.
After reviewing the most frequent failure mechanisms in power modules, the lecture will deal with the main approaches to lifetime prediction. The presentation will point out the major limitations occurring in practical applications, in particular for electric and hybrid vehicles.

Short CV: Mauro Ciappa received the M.S. degree in physics and mathematics from the University Zurich, Switzerland, and the Ph.D. degree in engineering sciences from the Swiss Federal Institute of Technology (ETH), Zurich, Switzerland. He joined the Reliability Laboratory, ETH, in 1986, where he was Head of the Failure Analysis and Reliability Physics Laboratory and Lecturer for reliability physics and failure analysis techniques since 1992. He is currently a Member of the Integrated Systems Laboratory, ETH, where he leads the group for Physical Characterization of Semiconductor Devices and is lecturer for modeling and characterization techniques of power devices.
He has published more than 150 papers in the field of reliability physics, high-resolution techniques for 2-D dopant profiling, high-resolution metrology by electron beams, dosimetry, and thermal management of power devices. Dr. Ciappa was awarded the IEEE Third Millennium Medal for hismcontributions to the reliability physics field.

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